GENEVA, Aug. 21 -- ESKRIDGE, Robert, Horace filed a patent application (US2025/015671) for “ANTI-PINCH APPARATUS FOR ADJUSTABLE ELECTRIC BED”. With publication no. WO/2026/173575, here are the other d... Read More
GENEVA, Aug. 21 -- CLOPAY CORPORATION filed a patent application (US2025/015507) for “ARTIFICIAL INTELLIGENCE (AI) DOOR SELECTOR TOOL”. With publication no. WO/2026/173569, here are the other details ... Read More
GENEVA, Aug. 21 -- HITACHI VANTARA LLC filed a patent application (US2025/015546) for “AUTOMATED DATA TIERING IN A DISTRIBUTED FILE SYSTEM”. With publication no. WO/2026/173570, here are the other det... Read More
GENEVA, Aug. 21 -- GOOGLE LLC filed a patent application (US2025/015583) for “RESOLVING UNSYNCHRONIZED INTERNET PROTOCOL MULTIMEDIA SUBSYSTEM CALL STATES BETWEEN A NETWORK AND A USER EQUIPMENT”. With ... Read More
GENEVA, Aug. 21 -- SALTENNA INC. filed a patent application (US2025/015358) for “HYBRID ANTENNA WITH DYNAMIC SIGNAL ROUTING FOR FREE-SPACE AND NEAR-METAL ENVIRONMENTS”. With publication no. WO/2026/17... Read More
GENEVA, Aug. 21 -- AMCOR FLEXIBLES NORTH AMERICA, INC. filed a patent application (US2025/015428) for “ULTRA THIN RECYLE READY LAMINATION WITH BARRIER”. With publication no. WO/2026/173567, here are t... Read More
GENEVA, Aug. 21 -- ROLL RITE, LLC filed a patent application (US2025/015443) for “COVER SYSTEM FOR A TRANSPORTABLE CONTAINER”. With publication no. WO/2026/173568, here are the other details related t... Read More
GENEVA, Aug. 21 -- SIEMENS INDUSTRY SOFTWARE INC. filed a patent application (US2025/015329) for “METHOD AND SYSTEM FOR GROUPING COMPONENTS FOR ELECTRONIC DESIGN AUTOMATION”. With publication no. WO/2... Read More
GENEVA, Aug. 21 -- MONSANTO TECHNOLOGY LLC filed a patent application (US2025/015337) for “MRI HAPLOID SORTING SYSTEM”. With publication no. WO/2026/173564, here are the other details related to the p... Read More
GENEVA, Aug. 21 -- UNISEAL, INC. filed a patent application (US2025/015352) for “LOW-TEMPERATURE CURABLE, HIGH GLASS TRANSITION TEMPERATURE ADHESIVE COMPOSITIONS FOR BONDING MAGNETS IN ELECTRIC AND HY... Read More